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Soft HT-SMD Foam Contact

Soft HT-SMD Foam Contact Solutions



Product Description


Laird’s SMD (Surface Mount Device) Grounding Contact is a foam-cored contact with a metalized polyimide film outer covering. It is used for circuit grounding of SMT (Surface Mount Technology) devices. These contacts are designed to be solder-reflow compatible, and are suitable for automatic processing.


Features and Benefits
  • Sn/Cu Plated PI Film outer layer
  • Silicon Foam Core
  • Soft SMD contacts are RoHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow-tunnel compatible to 260° C
Industries
5G HandsetAutomotive
Commercial TelecomComputing
ConsumerGaming
HandsetIndustrial Electronics
TabletsTelecom, 5G, Consumer, Automotive, Military

Capabilities
Automated PackagingCustom Automation
Custom Product DevelopmentPrototyping
ServiceTesting

Applications
Antenna ContactConducting on PCB
Grounding on PCB

Datasheets and Documents

emi-ds-fof-hightemp-smd-050916.pdf

Technical Specification

Compression Set<20%
Construction and CompositionMetallized PI film over Silicone Foam
Flame RetardancyUL94 V1
Foam Core MaterialSilicone
Gasket ProfileRectangular
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Parts (2)
↑ click on headings to sort ↓
Part NumberPart NameCompression SetConstruction and CompositionOperating Temperature Max (Celsius)Operating Temperature Min (Celsius)
SLM<20%Metallized PI film over Silicone Foam125-40
SSM<20%Metallized PI film over Silicone Foam125-40

EMI Shields and Gaskets

RF/Microwave Absorbers & Dieletrics

Thermal Interface Materials

Precision Metals

ISE (Integrated Solutions Engineered)



Company Address

Techni3 Ltd

Unit 4B Caerphilly Business Park

Caerphilly

CF83 3GS

+44 (0)29 2125 2100


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