HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE
Tflex SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive.
Tflex SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.
STANDARD THICKNESSES Standard thickness is 0.020-inch (0.50 mm) through 0.16-inch (4.064mm) in 0.010-inch increments MATERIAL NAME AND THICKNESS Tflex indicates Laird Technologies gap filler product line. SF8XXX indicates Tflex SF800 product line with thickness in mils (0.001-inches). EXAMPLES: Tflex SF840 = standard 0.040-inch thick Tflex SF800 material. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.
Features and Benefits
Silicone-free gap filler
Exceptionally low thermal resistance
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH