As military technology advances, heat rises

The next generation of technology in the military, such as high-powered radar jamming systems and hypersonic weapons, requires a large amount of processing power. As a result, processors in this technology contain many heat-generating components. Design engineers must find ways to reliably transfer and dissipate heat from these components to ensure the overall systems continue to operate effectively. In this article, field application and technical support engineer Daniel Ramirez describes how thermal interface materials play an essential role in the effort to manage heat in next-gen military technology.

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