5G wireless technology offers enhanced mobile broadband (eMBB), ultra-reliable low-latency communication (URLLC) and massive machine-type-communications (mMTC), which enable the growth of artificial intelligence and the Internet of Things technologies.
Compared to LTE-4G,5G wireless offers a higher base-belt frequency and will continue to expand to 30Ghz and beyond. However, the base-belt and other core chipsets, RF modules and components of 5G wireless technology consume more power due to higher data processing requirements, which makes the thermal management and EMI suppression capabilities of 5G AAU and other telecom devices (CU,DU) more challenging.
Thanks to Laird’s rich experience and many years of focus in telecom and 5G wireless, we have launched advanced thermal and EMI solutions, including integrated solutions, to help telecom engineers easily address the thermal and EMI challenges they face.
Small cells and 5G picocells are used to reinforce the AAU transmission signals for specified areas. The compact design and high frequency RF module and components create thermal and EMI issues.
Laird offers a range of performance materials that can help design engineers easily address thermal and EMI issues in small cells and 5G picocells.
SFP+/SFP28 is being widely used in 5G front-haul transmission to transfer the optical signal between AAU and DU.
Due to the harsh outdoor environment and the high sensitivity to temperature of LD chipsets and controller ICs in optical transceiver modules, an effective system cooling solution is required.
Laird offers the reliable materials design engineers need to manage the thermal and EMI issues in optical transceiver modules.
5G baseband devices (DU/CU) are designed for massive, complex network deployments. Laird offers various performance materials to manage thermal and EMI issues in DU/CU devices.
The core network can transfer call requests or data requests from different ports to different networks, usually requiring large data processing capabilities.
ASIC/FPGA chipsets and complex unit designs require high-performance materials to solve thermal and EMI problems and ensure reliable data processing.