Join Laird Staff Scientist Kaley Cancar for insights on the growing array of thermal compliance issues now facing electronic systems designers.
Providing enough cooling power is only a first step. An ever-worsening challenge is transferring growing heat loads from hot components into heat sinks and other cooling hardware.
In this recorded event, Kaley will trace the evolution of high-performance thermal interface materials (TIMs) and share steps electronic manufacturers are taking to create precision-designed TIMs.
