Introducing Tputty™ 910
Achieve impressive thermal resistance and reliability
When high-powered components are dependent on reliable thermal performance, Laird™ Tputty™ 910 is an ideal gap filler solution providing the lowest thermal resistance and highest thermal reliability available. A dispensable, soft solution, Tputty™ 910 minimizes stress on sensitive components. It also features low outgassing and a minimum bondline thickness as low as 180 µm.
Introducing Tputty™ 910
A one-part liquid dispensable gap filler with impressive thermal conductivity
Mitigate heat in high-power applications
As an ideal solution to fill small and medium gaps, Tputty™ 910 is used to transfer heat in applications including automotive multi-domain controllers, servers, telecom base stations, graphic chips, microprocessors, and more,
- Thermal conductivity 9.1W/mK
- Dispensable and compliant
- Easily reworkable
- Good vertical stability
- Low bondline thickness
- Low outgassing
- Meets ROHS and REACH requirements
Solve thermal challenges with a dispensable solution
- Operating temperature: -40°C to 180°C
- Minimum bondline thickness: 180µm+
- Density: 3.2 g/cc
- Available in syringes, cartridges and 1 gal-pail
- Shelf life of six months
- Easy flow for high dispensing productivity
