See our newly updated and comprehensive booklet describing our complete line of industry-leading thermal interface materials.
We focus on resolving the excess heat challenges you face. These challenges are exacerbated by faster, higher power, and more densely packed components and systems.
Included are overviews and specifications of the gap filler line of thermal pads and liquid gap fillers. Our products can be applied manually or using robotic motion control Our soft, thin, or ultra-thin thermal pads are complemented by Laird’s growing line of stress minimizing, one- and two-part liquid gap fillers.
Additional sections cover thermal phase change materials, thermal greases, electrical isolating insulators, thermally conductive printed circuit boards, and graphite materials.
Review this guide and refer to it often.
