Conductive Foam

Product Description

Laird’s EcoFoam™ CF500 offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side. EcoFoam™ can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. EcoFoam™ is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.

Features and Benefits

  • Widely thicknesses available
  • Excellent z-axis conductivity to provide good EMI shielding and grounding
  • Low compression forces allow for use of lighter materials
  • RoHS compliant and halogen free per IEC-61249-2-21 standard
  • The recommended operating compression for EcoFoam™ EMI gaskets will vary depending on the size of the gasket. Typically recommend to compress25% to 50% of the original height
  • Z Axis Resistance Range:  < 0.2


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Last Updated: 01/02/22

Technical Specification

Typical PropertiesColorGrey
Construction and CompositionConductive Foam+CPSA
Operating Temperature Max (Celsius)85
Operating Temperature Min (Celsius)-40
Shelf Life12 months under 23°C/65% R.H.
Electromagnetic PropertiesShielding Effectiveness (dB)87@300MHz; 108@3GHz; 78@18GHz
DimensionsThickness Range (mm)"0.3, 0.5, 0.7, 1.0, 1.5, 2.0, 2.5, 3.0, 4.0 mm"
ComplianceROHS CompliantYes