Conductive Foam
Product Description
Laird’s EcoFoam™ CF500 offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side. EcoFoam™ can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. EcoFoam™ is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.
Features and Benefits
- Widely thicknesses available
- Excellent z-axis conductivity to provide good EMI shielding and grounding
- Low compression forces allow for use of lighter materials
- RoHS compliant and halogen free per IEC-61249-2-21 standard
- The recommended operating compression for EcoFoam™ EMI gaskets will vary depending on the size of the gasket. Typically recommend to compress25% to 50% of the original height
- Z Axis Resistance Range: < 0.2
