CoolShield™ Flex

CoolShield™ Flex

Thermal and EMI Shielding Film

CoolShield-Flex is a stack-up film of thermal gap filler, metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.

Features and Benefits

  • Low height
  • Low weight
  • Efficient thermal path
  • Good shielding effectiveness
  • Ease of assembly with thermal interface material applied both sides
  • Can survive reflow
  • flexible film allows for PCB component height tolerance during assembly


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentPrototypingServiceTesting


Last Updated: 22/04/21

Technical Specification

Typical PropertiesColorCopper
Density (g/cc)2.50
Operating Temperature Max (Celsius)120
Operating Temperature Min (Celsius)-20
Electromagnetic PropertiesShielding Effectiveness @ 10GHz (dB)60.0
Shielding Effectiveness @ 1GHz (dB)50.0
Mechanical PropertiesHardness (Shore 00)40
ROHS CompliantYes
UL Flammability RatingUL 94 V0


5G5G Data Infrastructure5G Handset5G Peripherals5G TelecomAerospaceAutomotiveBlade serversCabinet ApplicationsCloudCommercial TelecomComputingConsumerConsumer Accessoriesconsumer and general applicationsConsumer ElectronicsData InfrastructureDatacomGamingGeneral applicationsHandsetHealthcareHealthcare / MedicalITMedicalMedical EquipmentMilitaryMobile DevicesMobile InfrastructureNetwork and telecommunications equipmentNetworkingOtherPersonal Medical DevicesRoboticsSatelliteSecurity and defenseServersSmall consumer electronicsTabletsTelecomTelecommunicationsVideo graphicsWearable electronicsWireless


EMI ShieldingLow Height ShieldingThermal Transfer