Thermal and EMI Shielding Film
CoolShield-Flex is a stack-up film of thermal gap filler, metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.
Features and Benefits
- Low height
- Low weight
- Efficient thermal path
- Good shielding effectiveness
- Ease of assembly with thermal interface material applied both sides
- Can survive reflow
- flexible film allows for PCB component height tolerance during assembly
