EMI Shielding/Thermal Gap Filler System
CoolShield solution integrates thermal products in to board level shielding covers so that they can provide both EMI shielding and heat transmission for ICs on electronics devices. Here, shielding cover can be a piece of stamped metal, a deep draw cover or even a die casting part while thermal product can vary according to application requirement including thermal gap filler, thermal grease, thermal Gel, phase change material, etc. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly.
Features and Benefits
- Shielding cover combined with Thermal Interface Material (TIM)
- Wide option of thermal products
- Silicone free available
- Simulation support for complex design
- Inhouse automation technology
