Eccostock™ FFP

Eccostock™ FFP

ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally and vibration protected

Features and Benefits

  • Light weight
  • Low shrinkage
  • Thermal insulation
  • one part curing system
  • Low loss dielectric

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 27/01/2021

Technical Specification

Typical PropertiesColorwhite
Density (g/cc)0.24
FunctionDielectric
Operating Temperature Max (Celsius)175
Operating Temperature Min (Celsius)-65
ResinEpoxy
Shelf LifeMinimum 720 Days from Date of Shipment
TypeLow Loss Dielectric curing
Thermal PropertiesThermal Conductivity (W/mK)0.05
Electromagnetic PropertiesLoss Tangent0.00500
Electrical PropertiesDielectric Constant1.30
Dielectric Constant Max1.25
Dielectric Constant Min1.25
Dielectric strength (Kv/mm)2.5
Volume Resistivity3.49 x10^11 Ohm-cm
ComplianceLead FreeYes
REACHYes
ROHS CompliantYes

Documents

Last Updated: 11/03/2022

Industries

Aerospace/DefenseHealthcare / Medical

Applications

Medical diagnostic