ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally and vibration protected
| Typical Properties | Color | white |
| Density (g/cc) | 0.24 | |
| Function | Dielectric | |
| Operating Temperature Max (Celsius) | 175 | |
| Operating Temperature Min (Celsius) | -65 | |
| Resin | Epoxy | |
| Shelf Life | Minimum 720 Days from Date of Shipment | |
| Type | Low Loss Dielectric curing | |
| Thermal Properties | Thermal Conductivity (W/mK) | 0.05 |
| Electromagnetic Properties | Loss Tangent | 0.00500 |
| Electrical Properties | Dielectric Constant | 1.30 |
| Dielectric Constant Max | 1.25 | |
| Dielectric Constant Min | 1.25 | |
| Dielectric strength (Kv/mm) | 2.5 | |
| Volume Resistivity | 3.49 x10^11 Ohm-cm | |
| Compliance | Lead Free | Yes |
| REACH | Yes | |
| ROHS Compliant | Yes |
Unit 4B Caerphilly Business Park
Caerphilly CF83 3GS