It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has excellent thermal characteristics, tolerating high and low temperatures. Material does not flake or shed. It s used in a variety of application from thin dielectric spacer in PCB to radome.
Features and Benefits
- Low dielectric constant
- Light weight and flexible
- Excellent thermal insulation and stability