Eccostock™ FlexK

Eccostock™ FlexK

It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has excellent thermal characteristics, tolerating high and low temperatures. Material does not flake or shed. It s used in a variety of application from thin dielectric spacer in PCB to radome.

Features and Benefits

  • Low dielectric constant
  • Light weight and flexible
  • Excellent thermal insulation and stability

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 24/06/2022

Technical Specification

Typical PropertiesColorWhite
Density (g/cc)0.55
FunctionDielectric
Operating Temperature Max (Celsius)177
Operating Temperature Min (Celsius)-70
Outgassing CVCM (%)0.110
Outgassing TML (%)0.840
ResinSilicone
Shelf LifeMinimum 720 Days from Date of Shipment
TypeLow loss dielectric elastomer
Thermal PropertiesThermal Conductivity (W/mK)0.11
Electromagnetic PropertiesLoss Tangent0.00200
Product Frequency Range0.1 - 10 Ghz
Electrical PropertiesDielectric Constant Max1.70
Dielectric Constant Min1.70
Dielectric strength (Kv/mm)4.0
Mechanical PropertiesTensile Strength (Mpa)0.9
DimensionsThickness Max (mm)0.50
Thickness Min (mm)0.50
ComplianceREACHYes
ROHS CompliantYes
OptionsOption Availability - PSAYes
Option Availability - on drawingYes

Documents

Last Updated: 11/03/2022

Industries

Aerospace/DefenseConsumerIndustrial

Applications

Base station/Power amplifier/Acitve antenna unit /small cell