GOF2000

Thermal Gasket

Laird’s Graphite‐over‐Foam (GOF), GOF2000 thermal gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket. GOF2000 combines the thermal transfer performance of the Tgon™ 9000 synthetic graphite outside wrap and the repeatable compression and rebound of a foam core. GOF2000 utilizes Laird LSF series silicone foam allowing for a UL V0 flammability rating.

Features and Benefits

  • High Deflection
  • High thermal transfer rate especially suitable for large gap sizes
  • Repeatable compression and rebound cycles
  • Lightweight
  • Low force thermal interface
  • Abrasion resistant exterior
  • Ease of manufacturing for high volume
  • Use multiple 5mm width columns to lower overall thermal resistance
  • High operating temperature suitability and UL V0 flammability rating

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentPrototypingServiceTesting

Datasheets

Last Updated: 31/08/21

Technical Specification

Typical PropertiesColorBlack
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Mechanical PropertiesRecommended Compression Range(%)25
DimensionsThickness Max (mm)9.80
Thickness Min (mm)1.00
ComplianceLead FreeYes
REACHYes
ROHS CompliantYes
UL Flammability RatingUL 94 V0 (pending)

Industries

5G5G Data Infrastructure5G Handset5G Peripherals5G TelecomAerospaceAutomotiveAutomotive and Industrial ElectronicsAutonomous VehicleBlade serversCabinet ApplicationsCloudCommercial TelecomComputingConsumerConsumer Accessoriesconsumer and general applicationsConsumer ElectronicsData InfrastructureDatacomElectric VehicleGeneral applicationsHealthcareHealthcare / MedicalIndustrialIndustrial ElectronicsIndustrial MarketsIndustrial/ProductionITMedicalMedical EquipmentMilitaryMobile InfrastructureNetwork and telecommunications equipmentNetworkingOtherPrintersRoboticsSatelliteSecurity and defenseServersTelecomTelecommunicationsTest & MeasureTest and MeasureTransportationVideo graphicsWireless

Applications

Large Component GapOptical ModuleSliding ConnectionThermal Transfer