GOF3000

Thermally Conductive EMI Gasket

Laird’s electrically conductive Graphite-over-Foam, GOF3000 thermal and EMI gasket, provides thermal conductivity in the form of a traditional wrapped compressible foam gasket, and contains an outside wrap for electrical conductivity. GOF3000 combines the thermal transfer performance of the Tgon™ 9000 synthetic graphite outside wrap and the repeatable compression and rebound of the foam core. GOF3000 utilizes a silicone foam core for lower compression force and UL V0 flammability rating.

Features and Benefits

  • Electrical conductivity for EMI grounding
  • High deflection
  • Repeatable compression and rebound cycles
  • Good thermal conductivity between interfaces
  • Lightweight
  • Low force thermal interface
  • Abrasion resistant exterior
  • Ease of manufacturing for high volume
  • Meets environmental standards requirements
  • UL V0 flammability rating

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 29/04/21

Technical Specification

Typical PropertiesColorCopper
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Electromagnetic PropertiesShielding Effectiveness @ 10GHz (dB)75
Shielding Effectiveness @ 1GHz (dB)75
Shielding Effectiveness @ 20GHz (dB)65
Electrical Properties Z-axis Resistance (Ohm)0.009
Mechanical Properties Recommended Compression Range(%)25
DimensionsThickness Max (mm)9.70
Thickness Min (mm)1.10
ComplianceLead FreeYes
REACHYes
ROHS CompliantYes
UL Flammability RatingUL 94 V0 (pending)

Industries

5G5G Data Infrastructure5G Handset5G Peripherals5G TelecomAerospaceAutomotiveAutomotive and Industrial ElectronicsAutonomous VehicleBlade serversCabinet ApplicationsCloudCommercial TelecomComputingConsumerConsumer Accessoriesconsumer and general applicationsConsumer ElectronicsData InfrastructureDatacomElectric VehicleEnergy & UtilitiesGamingGeneral applicationsHealthcareHealthcare / MedicalIndustrialIndustrial ElectronicsIndustrial MarketsIndustrial/ProductionITMedicalMedical EquipmentMilitaryMobile InfrastructureNetwork and telecommunications equipmentNetworkingOtherPrintersRoboticsSatelliteSecurity and defenseServersTelecomTelecommunicationsTest & MeasureTest and MeasureTransportationVideo graphicsWireless

Applications

EMI ShieldingLarge Component GapOptical ModuleSliding ConnectionThermal Transfer