Heatsink/EMI Shielding/Thermal Gap Filler System
HeatsinX solution provides a die-cast, deep drawn, or stamped heatsink that has been enhanced for its design needs with a combination of thermal interface material, CoolZorb, Form-in-Place EMI gaskets, RF absorbers, or EMI shielding solutions. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly, leading to a simplified sourcing structure and lower total cost of ownership for out customers.
Features and Benefits
- Heatsink combined with Thermal Interface Material (TIM) / EMI Shielding / EMI Absorbing
- Wide option of thermal products (automated TIM pick and place or dispensable TIM)
- Wide option of Form-in-Place conductive gaskets
- Automated application of Fabric over Foam conductive gaskets or conductive foam
- Combination with CoolZorb line of products for high frequency application
- Simulation support for complex design
- Inhouse automation technology
