Heatsink/EMI Shielding/Thermal Gap Filler System

HeatsinX solution provides a die-cast, deep drawn, or stamped heatsink that has been enhanced for its design needs with a combination of thermal interface material, CoolZorb, Form-in-Place EMI gaskets, RF absorbers, or EMI shielding solutions. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly, leading to a simplified sourcing structure and lower total cost of ownership for out customers.

Features and Benefits

  • Heatsink combined with Thermal Interface Material (TIM) / EMI Shielding / EMI Absorbing
  • Wide option of thermal products (automated TIM pick and place or dispensable TIM)
  • Wide option of Form-in-Place conductive gaskets
  • Automated application of Fabric over Foam conductive gaskets or conductive foam
  • Combination with CoolZorb line of products for high frequency application
  • Simulation support for complex design
  • Inhouse automation technology


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentPrototypingServiceTesting

Technical Specification

ROHS CompliantYes


Last Updated: 22/04/21


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