Form-in-Place Gasket

Laird’s Form-In-Place is an automated system for dispensing non-conductive and conductive elastomer EMI shielding and grounding gaskets onto metal substrates. This product is particularly ideal for base stations, PDAs, PC cards, radios, and mobile phones, as well as many other cast enclosures and packaged electronic assemblies.

Features and Benefits

  • Form-in-place gasketing offers a total cost savings in the form of reduced raw materials, labor or assembly time
  • Room temperature cure gasketing materials eliminate the need for costly heat curing systems, allowing the use of inexpensive plastic or metal substrates
  • Single-component compounds eliminate the need for mixing ingredients, thereby shortening production cycles and eliminating related waste
  • Easy to program operating system allows for quick part-to-part changeover, minimal tooling investment for new designs, and prototype development in 24 to 48 hours
  • High shielding effectiveness: 85–100 dB up to 10 GHz


Automated PackagingCustom AutomationCustom Product DevelopmentPrototypingServiceTesting


Last Updated: 11/04/22

Technical Specification

Typical PropertiesColorTransprarent
Filler TypeNon-conductive
Gasket ProfileD-Shape
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-50
Resin TypeSilicone
Mechanical PropertiesCompression Set<20


Last Updated: 22/04/21


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