Soft HB-SMD Foam Contact

Laird Performance Materials’ HB-SMD is one of the Soft SMD (Surface Mount Device) Contact series which is used for circuit grounding and shielding of SMT (Surface Mount Technology) devices. This contact is designed to be solder reflow compatible and suitable for automatic processing.  HB-SMD is composited of a tin/copper PIfilm over polyurethane foam with rectangular shape (SLG series) and hourglass shape (SLH series).

Features and Benefits

  • Sn/Cu Plated PI Film outer layer
  • Polymeric Foam Core
  • Soft SMD contacts are ROHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow tunnel compatible to 260°C
  • UL94 HB Flammability Rating
  • Length Options: ≥3 mm
  • Width Options: ≥3 mm
  • Z Axis Resistance Range:  @30% compression before reflow Ω <0.10 after reflow <0.10 (Larid internal 5mm x5mm x5mm)


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Technical Specification

Typical PropertiesConstruction and CompositionMetallized PI film over Polyurethane Foam
Gasket ProfileRectangular
Operating Temperature Max (Celsius)85
Operating Temperature Min (Celsius)-40
Mechanical PropertiesCompression Set<20%
DimensionsThickness Range (mm)≥ 1.5 mm
ComplianceROHS CompliantYes
UL Flammability RatingUL94 HB