Soft HT-SMD Foam Contact

Laird Performance Materials’ HT-SMD is one of the Soft SMD (Surface Mount Device) Contact series which is used for circuit grounding and shielding of SMT (Surface Mount Technology) devices. This contact is designed to be solder reflow compatible and suitable for automatic processing.HT-SMD is composited of a tin/copper PI film over silicone foam.  SLM series is standard type with rectangular shape;  SSM series is similar t o SLM series but with lower compression force;  SLN series is hourglass or customized shape.

Features and Benefits

  • Sn/Cu Plated PI Film outer layer
  • Polymeric Foam Core
  • Soft SMD contacts are ROHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow tunnel compatible to 260°C
  • UL94 V1 Flammability Rating
  • Length Options:  ≥ 2 mm, 
  • Width Options: ≥2 mm
  • Z Axis Resistance Range:  @30% compression before reflow Ω <0.10 after reflow <0.10 (Laird internal 5mm x5mm x5mm)


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Technical Specification

Typical PropertiesConstruction and CompositionMetallized PI film over Silicone Foam
Gasket ProfileRectangular
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Mechanical PropertiesCompression Set<20%
DimensionsThickness Range (mm)≥ 1.8 mm
ComplianceROHS CompliantYes
UL Flammability RatingUL94 V1