SNC50-HXP

SNC50-HXP

Form-in-Place Gasket

Laird’s Form-In-Place is an automated system for dispensing non-conductive and conductive elastomer EMI shielding and grounding gaskets onto metal substrates. This product is particularly ideal for base stations, PDAs, PC cards, radios, and mobile phones, as well as many other cast enclosures and packaged electronic assemblies.

Features and Benefits

  • Form-in-place gasketing offers a total cost savings in the form of reduced raw materials, labor or assembly time
  • Room temperature cure gasketing materials eliminate the need for costly heat curing systems, allowing the use of inexpensive plastic or metal substrates
  • Single-component compounds eliminate the need for mixing ingredients, thereby shortening production cycles and eliminating related waste
  • Easy to program operating system allows for quick part-to-part changeover, minimal tooling investment for new designs, and prototype development in 24 to 48 hours
  • High shielding effectiveness: 85–100 dB up to 10 GHz

Capabilities

Automated PackagingCustom AutomationCustom Product DevelopmentPrototypingServiceTestingVirtual Design Centre

Datasheets

Last Updated: 16/07/21

Technical Specification

Typical PropertiesColorGray
Filler TypeNickel/Graphite
Gasket ProfileTriangular
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-50
Resin TypeSilicone
Electromagnetic PropertiesShielding Effectiveness (dB)>100
Electrical PropertiesVolume Resistivity0.03 Ohm-cm
Mechanical PropertiesCompression Set<20
Hardness50
ComplianceUL Flammability RatingV0

Documents

Last Updated: 22/04/21

Industries

5G5G Data Infrastructure5G TelecomAutomotiveAutomotive and Industrial ElectronicsAutonomous VehicleCloudConsumerDatacomHealthcare / MedicalIndustrialMilitaryNetwork and telecommunications equipmentOtherRailTelecomTest & MeasureWireless

Applications

IT cabinetsradarRemote radio unitsTelecom cabinetsWireless infrastructure