Tflex™ 300

Tflex™ 300

Silicone based Thermal Gap Filler

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.

Features and Benefits

  • Extreme compliancy allows material to “totally blanket” component(s)
  • Low compression set enables the pad to be reused many times

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 25/09/23

Technical Specification

Typical PropertiesColorLight Green
Density (g/cc)1.80
Operating Temperature Max (Celsius)160
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.100
Outgassing TML (%) 0.560
Shelf Life2 years from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)1.20
Thermal Resistance @10 psi Max (C-in2/W)4.256
Thermal Resistance @10 psi Min (C-in2/W)1.135
Thermal Resistance @30 psi Max (C-in2/W)2.981
Thermal Resistance @30 psi Min (C-in2/W)0.905
Thermal Resistance @50 psi Max (C-in2/W)1.775
Thermal Resistance @50 psi Min (C-in2/W)0.740
Electrical PropertiesDielectric Constant4.50
Volume Resistivity1.00 x10^13 Ohm-cm
Mechanical PropertiesHardness (Shore 00)25
DimensionsThickness Max (inches)0.200
Thickness Max (mm)5.08
Thickness Min (inches)0.020
Thickness Min (mm)0.51
ComplianceREACHYes
ROHS CompliantYes
UL Flammability RatingV-0

Documents

Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/04/21

Industries

Aerospace/DefenseAutomotiveConsumerIndustrialTelecom/Datacom

Applications

Automotive ADASAutomotive ElectronicsAutomotive InfotainmentAutomotive Powertrain/ECUsDrones/SatellitesGaming SystemsInstrumentationNotebooks/Tablets/Portable DevicesRoutersSmart Home DevicesWireless infrastructure