Silicone based Thermal Gap Filler
Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Features and Benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Low compression set enables the pad to be reused many times
