Silicone based Thermal Gap Filler
The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed
dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production.
Features and Benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Low compression set enables the pad to be reused many times
- Provides a dielectric barrier
