Tflex 300TG

Tflex 300TG

Silicone based Thermal Gap Filler

The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed

dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production.

Features and Benefits

  • Extreme compliancy allows material to “totally blanket” component(s)
  • Low compression set enables the pad to be reused many times
  • Provides a dielectric barrier


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 22/04/21

Technical Specification

Typical PropertiesColorLight Green
Density (g/cc)1.80
Operating Temperature Max (Celsius)160
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.100
Outgassing TML (%)0.560
Reinforcement CarrierTgard
Shelf Life 2 years from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)1.20
Electrical PropertiesDielectric Constant4.50
Volume Resistivity 1.00 x10^13 Ohm-cm
Mechanical PropertiesHardness (Shore 00)27
Dimensions Thickness Max (inches) 0.200
Thickness Max (mm)5.00
Thickness Min (inches)0.020
Thickness Min (mm)0.51
ROHS CompliantYes
UL Flammability RatingV-0


Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/04/21
Last Updated: 27/12/21




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