Silicone based Thermal Gap Filler
Compliant 2.8 W/mK Thermally Conductive Gap Filler
Tflex 50000 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tflex 50000’s unique silicone and filler combination has extremely low silicone extractables compared to many other silicone interface products. Tflex 50000 meets NASA outgassing specification. Tflex 50000 is naturally tacky, no adhesive coating is required. Tflex 50000 is electrically insulating, stable from -50ºC to 200ºC and is certified to UL 94V0 flammability rating.
Features and Benefits
- Low pressure versus deflection
- Highly compliant and cost effective
- Minimizes board and component stress
- Naturally tack for easy assembly
- Low silicone extractables
