Silicone based Thermal Gap Filler
Product Description
EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER
Tflex 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal resistances.
Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is stable from -45°C to 200°C and meets UL 94 V0 rating.TACKY ONE SIDE ONLY
Tflex 600 is naturally tacky on both sides. Tflex 600 can be provided tacky on one side only. This is indicated by the suffix DC. This option offers good separation properties allowing the tacky side to stick to the heatsink/chasis/cold plate/etc. and the other dry side to release easily from the component(s).
REINFORCEMENT
Fiberglass is required in 0.020 inch (0.51mm) and 0.030 inch (0.76mm). Thicknesses of 0.040 inch (1.02mm) and above do not require reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.
Features and Benefits
- Very high compliancy for low stress applications
- Low dielectric constant
- Naturally tacky, needs no further adhesive coating
