Tflex™ HD300TG

Tflex™ HD300TG

Thermal Gap Filler

Laird Tflex™ HD300TG is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300TG is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300TG while generating minimal board and component stress.Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.

Tflex HD300TG material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.

The Tgard™ liner is incorporated to offer guaranteed >6KV AC dielectric barrier, a cut-through resistant surface and a non-tacky surface for easy handling. 

Features and Benefits

  • 2.7 W/m K thermal conductivity 
  • Low pressure versus deflection characteristics 
  • Excellent surface wetting for low contact resistance.  
  • Minimizes board and component stress.
  • Large tolerance applications
  • ROHS and REACH compliant


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 16/06/21

Technical Specification

Typical PropertiesColorTan
Density (g/cc)3.10
Operating Temperature Max (Celsius)180
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.100
Outgassing TML (%)0.390
Thermal PropertiesThermal Conductivity (W/mK)2.70
Electrical PropertiesDielectric Constant6.60
Volume Resistivity1.2x 1014
Mechanical PropertiesHardness (Shore 00)38
ComplianceLead FreeYes
ROHS CompliantYes
UL Flammability RatingV-0


Last Updated: 16/06/21


Aerospace/DefenseAutomotive and Industrial Electronicselectrical power generatorsIndustrial ElectronicsIndustrial MarketsSwitch mode power suppliesUPS unit