Thermal Gap Filler
Laird Tflex™ HD300TG is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300TG is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300TG while generating minimal board and component stress.Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.
Tflex HD300TG material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.
The Tgard™ liner is incorporated to offer guaranteed >6KV AC dielectric barrier, a cut-through resistant surface and a non-tacky surface for easy handling.
Features and Benefits
- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance.
- Minimizes board and component stress.
- Large tolerance applications
- ROHS and REACH compliant
