Tflex™ HD7.5

Tflex™ HD7.5

Silicone based Thermal Gap Filler

Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.

Features and Benefits

· 7.5 W/mK thermal conductivity soft pad

· Low pressure versus deflection

· Minimizes board and component stress

· Low outgassing and oil bleeding

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Tflex HD7.5 Data Sheet

Last Updated: 01/08/23

Technical Specification

Typical Properties	Color	Grey
	Density (g/cc)	3.40
	Minimum Bondline Thickness (microns)	1000
	Minimum Bondline Thickness (mm)	1.00
	Operating Temperature Max (Celsius)	125
	Operating Temperature Min (Celsius)	-50
Thermal Properties	Thermal Conductivity (W/mK)	7.50
	Thermal Resistance @10 psi Max (C-in2/W)	0.133
	Thermal Resistance @10 psi Min (C-in2/W)	0.119
	Thermal Resistance @30 psi Max (C-in2/W)	0.087
	Thermal Resistance @30 psi Min (C-in2/W)	0.081
	Thermal Resistance @50 psi Max (C-in2/W)	0.083
	Thermal Resistance @50 psi Min (C-in2/W)	0.077
Electrical Properties	Dielectric Breakdown Voltage (Volts AC)	6.9
	Volume Resistivity	1.1X10^14
Mechanical Properties	Hardness (Shore 00)	15
Dimensions	Thickness Max (Microns)	5000.0
	Thickness Max (inches)	0.200
	Thickness Max (mm)	5.00
	Thickness Min (Microns)	1000.0
	Thickness Min (inches)	0.040
	Thickness Min (mm)	1.00
Compliance	Lead Free	Yes
	REACH	Yes
	ROHS Compliant	Yes