Silicone based Thermal Gap Filler
Tflex™ HD700 thermal gap filler combines 5 W/mK thermalconductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, less mechanical and thermalstresses will be experienced within your device.
Tflex™ HD700PI can be provided with an integrated polyimidefilm on one side. This liner provides numerous application benefits likeelectrical isolation, placement ease during assembly, and tear resistance forapplications that require shear.
Tflex™ HD700 and Tflex™ HD700PI areavailable in thickness from 0.5mm (0.020”) to 5mm (0.200”). The standard material Tflex™ HD700 materialis a light pink color, but we do have the option to provide this in a greycolor if a neutral color is desired (Tflex HD700,GR).
Features and Benefits
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress
- Large tolerance applications
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
