Tflex™ HD80000

Tflex™ HD80000

Silicone based Thermal Gap Filler

Tflex HD80000 combines 6.0 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.

The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.

Features and Benefits

  • Low pressure versus deflection
  • Excellent surface wetting for low contact resistance
  • No fiberglass reinforcement
  • Minimizes board and component stress
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 07/06/23

Technical Specification

Typical PropertiesColorTeal
Density (g/cc)3.30
Operating Temperature Max (Celsius)150
Operating Temperature Min (Celsius)-65
Outgassing CVCM (%)0.040
Outgassing TML (%)0.300
Shelf Life2 years from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)6.00
Thermal Resistance @10 psi Max (C-in2/W)0.768
Thermal Resistance @10 psi Min (C-in2/W)0.251
Thermal Resistance @30 psi Max (C-in2/W)0.125
Thermal Resistance @30 psi Min (C-in2/W)0.106
Thermal Resistance @50 psi Max (C-in2/W)0.103
Thermal Resistance @50 psi Min (C-in2/W)0.097
Electrical PropertiesDielectric Constant9.00
Volume Resistivity1.10 x10^14 Ohm-cm
Mechanical PropertiesHardness (Shore 00)40
DimensionsThickness Max (Microns)5000.0
Thickness Max (inches)0.200
Thickness Min (Microns)1000.0
Thickness Min (inches)0.040
ROHS CompliantYes
UL Flammability RatingV-0


Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/04/21
Last Updated: 22/04/21
Last Updated: 27/12/21




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