Silicone based Thermal Gap Filler
Tflex HD80000 combines 6.0 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
Features and Benefits
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- No fiberglass reinforcement
- Minimizes board and component stress
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
