Silicone based Thermal Gap Filler
Tflex HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
Tflex HD90000 is available in thickness from 0.040″ (1000 µm) to 0.200″ (5000 µm). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.
Features and Benefits
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress
- Low Outgassing
- Low D3-D20 (< 20ppm)
- Large tolerance applications
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
