Tflex HD90000

Tflex HD90000

Silicone based Thermal Gap Filler

Tflex HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.

Tflex HD90000 is available in thickness from 0.040″ (1000 µm) to 0.200″ (5000 µm). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.

Features and Benefits

  • Low pressure versus deflection
  • Excellent surface wetting for low contact resistance
  • Minimizes board and component stress
  • Low Outgassing
  • Low D3-D20 (< 20ppm)
  • Large tolerance applications
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 22/08/23

Technical Specification

Typical PropertiesColorGrey
Density (g/cc)3.50
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-50
Outgassing CVCM (%)0.010
Outgassing TML (%)0.170
Shelf Life1 year from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)7.50
Thermal Resistance @10 psi Max (C-in2/W)0.539
Thermal Resistance @10 psi Min (C-in2/W)0.154
Thermal Resistance @30 psi Max (C-in2/W)0.203
Thermal Resistance @30 psi Min (C-in2/W)0.074
Thermal Resistance @50 psi Max (C-in2/W)0.129
Thermal Resistance @50 psi Min (C-in2/W)0.061
Electrical PropertiesDielectric Constant8.10
Volume Resistivity8.70 x10^13 Ohm-cm
Mechanical PropertiesHardness (Shore 00)32
DimensionsThickness Max (Microns)5000.0
Thickness Max (inches)0.200
Thickness Min (Microns) 500.0
Thickness Min (inches)0.020
ROHS CompliantYes
UL Flammability RatingV-0


Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/04/21
Last Updated: 22/04/21




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