Tflex™ HP34

Tflex™ HP34

High Performance Gap Filler

Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties. 
Tflex™ HP34 Introduction Video 

Features and Benefits

  • 34 W/mK bulk thermal conductivity
  • Silicone Free formulation
  • Maintains thermal performance under increased pressure
  • Low contact resistance with mating surfaces
  • Environmentally friendly solution that meets RoHS and REACH

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 22/08/23

Technical Specification

Typical PropertiesColorGrey
Density (g/cc)2.30
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Shelf Life1 years from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)34.00
Thermal Resistance @10 psi Max (C-in2/W)0.212
Thermal Resistance @10 psi Min (C-in2/W)0.106
Thermal Resistance @30 psi Max (C-in2/W)0.185
Thermal Resistance @30 psi Min (C-in2/W)0.059
Thermal Resistance @50 psi Max (C-in2/W)0.110
Thermal Resistance @50 psi Min (C-in2/W)0.048
Electrical PropertiesVolume Resistivity10 Ω-cm
Mechanical PropertiesHardness (Shore 00)50
DimensionsThickness Max (Microns)5000.0
Thickness Max (inches)0.200
Thickness Max (mm)4500.00
Thickness Min (Microns)0.2
Thickness Min (inches)0.040
Thickness Min (mm)1.00
ComplianceLead FreeYes
REACHYes
ROHS CompliantYes
UL Flammability RatingV-0 (Pending)

Documents

Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/08/23
Last Updated: 27/12/21
Last Updated: 12/04/21

Industries

5G Data Infrastructure5G TelecomAerospace/DefenseAutomotiveConsumer ElectronicsData InfrastructureDatacomServers

Applications

5G Antenna RadomeInstrumentation/Test and measureNotebooks/Tablets/Portable DevicesRoutersServersSmart Home DevicesTelecom cabinetsWireless infrastructure