High Performance Gap Filler
Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties.
Tflex™ HP34 Introduction Video
Features and Benefits
- 34 W/mK bulk thermal conductivity
- Silicone Free formulation
- Maintains thermal performance under increased pressure
- Low contact resistance with mating surfaces
- Environmentally friendly solution that meets RoHS and REACH