Silicone based Thermal Gap Filler
Mid-Performance Gap Filler with 3 W/mK. Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. TflexHR600™s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly.
Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport.
Tflex HR600 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0flame rating.
Standard Thicknesses
0.010-inch to 0.200-inch (0.25 to 5.0 mm)
0.010-inch and 0.015-inch thick materials come standard with fiberglass reinforcement designated by the suffix œFG
Options
Proprietary DC1 option available to eliminate tack from one side to aid in handling.
Material Name and Thickness
Tflex indicates elastomeric gap filler product line
HR6xxx indicates high recovery ˜6 series™ 3 W/mK material
FG designates Fiberglass (available in 0.010 and 0.015-inch thickness only)
DC1 designates proprietary option eliminating tack from one side
Examples
Tflex HR6120 = 0.120-inch thick material
Tflex HR610FG = 0.010-inch thick material with fiberglass reinforcement
Tflex HR6120-DC1 = 0.120-inch thick material with proprietary DC1 option
Features and Benefits
- Thermal conductivity 3 W/mK
- Soft and compliant
- Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
- Naturally tacky for adhesion during assembly and transport
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
