Tflex™ SF10

Tflex™ SF10

Silicone Free Thermal Gap Filler

Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

Features and Benefits

  • Silicone free formulation
  • Low Shore Hardness
  • Low pressure versus deflection
  • Minimizes board and component stress
  • No fiberglass reinforcement
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 01/11/23

Technical Specification

Typical PropertiesColorGrey
Density (g/cc)3.70
Operating Temperature Max (Celsius)125
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.150
Outgassing TML (%)0.330
Reinforcement Carriernone
Shelf Life2 years from Date of Shipment
Thermal PropertiesThermal Conductivity (W/mK)10.20
Thermal Resistance @10 psi Max (C-in2/W)0.643
Thermal Resistance @10 psi Min (C-in2/W)0.054
Thermal Resistance @30 psi Max (C-in2/W)0.043
Thermal Resistance @30 psi Min (C-in2/W)0.041
Thermal Resistance @50 psi Max (C-in2/W)0.042
Thermal Resistance @50 psi Min (C-in2/W)0.039
Electrical PropertiesDielectric Constant9.00
Volume Resistivity1 x 10^14
Mechanical PropertiesHardness (Shore 00)41
DimensionsThickness Max (Microns)5000.0
Thickness Max (inches)0.200
Thickness Max (mm)5.00
Thickness Min (Microns)500.0
Thickness Min (inches)0.020
Thickness Min (mm)0.50
ComplianceLead FreeYes
ROHS CompliantYes
UL Flammability RatingV-0 pending


Last Updated: 01/11/23
Last Updated: 01/11/23
Last Updated: 06/12/23
Last Updated: 01/11/23
Last Updated: 01/11/23




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