Silicone Free Thermal Gap Filler
Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.
Features and Benefits
- Silicone free formulation
- Low Shore Hardness
- Low pressure versus deflection
- Minimizes board and component stress
- No fiberglass reinforcement
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH