Silicone Free Thermal Gap Filler
Compliant Silicone-Free 3.0 W/mK thermally conductive Gap Filler
Tflex SF600 is a high performance silicone-free thermal gap filler with a conductivity of 3.0 W/mK. Tflex SF600 is designed for applications which are silicone sensitive.
RoHS compliant.
Standard Thickness
Standard thickness is 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) and available in 0.010-inch (0.25 mm) increments. 0.010-inch is only available in custom cut parts (sheet material is not available).
MATERIAL NAME AND THICKNESS
Tflex indicates Laird Technologies™ brand thermally conductive elastomeric gap filler product. SF6xx indicates ˜SF600 series™ 3.0 W/mK material and xxx indicates thickness in mils (0.001-inches)
Examples:
Tflex SF620 = 0.020-inch thick material
Features and Benefits
- Silicone free
- Low Dielectric Constant
- Differential tack option available for easy assembly and rework
- Minimal compression set
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
