Ultra-thin Thermal Gap Filler
Ultra-thin gap filler offering great thermal performance and handling. Tflex UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly.
The elastomeric property of Tflex UT20000 provides excellent interfacing and wetting out mating surfaces in thin interface where efficiently transfer heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements.
Tflex UT20000 is electrically non-conductive, stable from -40°C thru 200°C and offered in thicknesses that range from 0.008 inches (0.2mm) up to 0.040 inches (1.0mm).
Features and Benefits
- No fiberglass carrier to minimize thermal resistance, yet still easy to handle
- Excellent surface wetting for low contact resistance
- Unique formulation minimizes thermal resistance at low mounting forces
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH.
