Thermally Conductive Pre-preg
Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.
The heart of this system is the thermally conductive pre-preg, Tlam™ PP HTD. This ceramically filled 2.2 W/mK, dielectric prepreg offers 8 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. Tlam™ PP HTD is a “B” State epoxy film providing room temperature stability for 6 months. Tlam™ PP HTD is provided in multiple thicknesses. Thinner films offer better thermal performance while thicker films offer better dielectric strength.
Tlam™ PP HTD can be used to build many different combinations of PCB laminates. The simplest is copper foil, Tlam™ PP HTD dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam™ PP HTD and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.
Tlam™ PP HTD can laminated with copper foils from ½ oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick. Further Tlam™ PP HTD and be laminated on both sides with copper films to make traditional type PCB Cores.
Features and Benefits
· Low Thermal Resistance for SMD & Chip & Wire Components
· Compatible with Heavy Copper Foil & most Pre-pregs
· Low Modulus for Stress Relief & High Reliability
· High Tg for Excellent HV & Hi-Temperature Operation (1HTD)
· Mechanically Rugged under Vibration and Mechanical Shock
· Integral aluminum Base Plate for Mechanical & Thermal Interface
· Compatible with Power Substrate & Multilayer Construction
· Uses Standard low-cost PCB Fabrication Techniques
· Can run through standard pick and place SMT and manual wire bond processes.
