Tpcm™ 5000

Tpcm™ 5000

Thermal Phase Change Material

Tpcm™ 5000 is a new high-performance TIM in the Laird product offering.   Tpcm™ 5000 is designed to provide the best performance to price available.  Tpcm™ 5000 provides very low thermal resistance by coupling high thermal conductivity of 5.3 W/mK, minimal bondline thickness, and with superior wetting of the mating surfaces. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 25µm.    Tpcm™ 5000 reliability has been demonstrated though exposure to 1000 hours of various aging tests resulting in proven dependability at an operating temperature of 125°C.  The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials.  Tpcm™ 5000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.

Features and Benefits

  • 5.3 W/mK bulk thermal conductivity
  • Cost effective
  • Non silicone formulation that provides naturally tacky surface
  • Fully characterized long term reliability
  • No pump out
  • Easy rework

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 20/09/23

Documents

Last Updated: 03/03/22
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Industries

AutomotiveComputingConsumerDatacomElectric VehicleIndustrial ElectronicsMedical EquipmentSatelliteServersTelecommunicationsVideo graphics

Applications

Automotive InfotainmentComputer serversGraphic CardsIGBTsNotebooks/Tablets/Portable DevicesPower ConvertersPower Supplies