Tpcm™ 7000

Tpcm™ 7000

Thermal Phase Change Material

Tpcm™ 7000 is newest in Laird’s line of  high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics.  Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm.Coupled with superior wetting of the mating  surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance.  Tpcm™ 7000 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 150°C.  The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive  greases and other phase change materials.  Tpcm™ 7000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.

Features and Benefits

7.5 W/mK bulk thermal conductivityNo pump outFully characterized long term reliabilityNon silicone formulation that provides naturally tacky surfaceEnvironmentally friendly solution that meets regulatory requirements including RoHS and REACH


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentPrototypingServiceTesting


Last Updated: 17/03/23

Technical Specification

Typical PropertiesShelf Life1 year from date of shipment
Thermal PropertiesThermal Conductivity (W/mK)7.50


Last Updated: 06/07/23
Last Updated: 23/09/21
Last Updated: 27/12/21
Last Updated: 22/11/21
Last Updated: 21/10/21
Last Updated: 29/11/22


ComputingIndustrial ElectronicsServersTelecom/DatacomVideo graphics


Desktop computersGaming SystemsGraphic CardsNotebook computersPower Converters