Tpcm™ 900

Tpcm™ 900

Thermal Phase Change Material

Tpcm 900 is a high performance, non-electrically conductive phase change material. At 50deg C, Tpcm 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component’s surfaces, thereby reducing thermal resistance. Tpcm 900 is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.Tpcm 900 shows no thermal performance degradation after 1,000 hours @130deg C, or after 500 cycles, from -25deg C to 125deg C. The material softens and does not fully change state resulting in minimal migration (pump out) at operating temperatures (see viscosity curve). Tpcm 900 is supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die cut parts can also be supplied.

Features and Benefits

  • Naturally tacky at room temperature, no adhesive required
  • No heatsink preheating required

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 22/04/21

Technical Specification

ComplianceROHS CompliantYes

Documents

Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21

Industries

ConsumerTelecom/Datacom

Applications

Graphic CardsHard Disk DrivesIGBTsMemory ModulesNotebooks/Tablets/Portable DevicesServersSmart Home DevicesWireless infrastructure