Silicone based Thermal Gap Filler
Tpli 200 is an Exceptionally Soft, Highly Compressible Gap Filler premium gap filler. Tpli 200’s exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli 200 is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating
Features and Benefits
- Low Dielectric Constant
- High thermal performance
