Tpli™ 200

Tpli™ 200

Silicone based Thermal Gap Filler

Tpli 200 is an Exceptionally Soft, Highly Compressible Gap Filler premium gap filler. Tpli 200’s exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli 200 is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating

Features and Benefits

  • Low Dielectric Constant
  • High thermal performance


Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting


Last Updated: 13/07/22

Technical Specification

Typical PropertiesColorVaries
Density (g/cc)1.40
Operating Temperature Max (Celsius)200
Operating Temperature Min (Celsius)-45
Outgassing CVCM (%)0.150
Outgassing TML (%)0.460
Shelf Life2 years from Date of Shipment , 1 year if Adhesive if added
Thermal PropertiesThermal Conductivity (W/mK)6.00
Thermal Resistance @10 psi Max (C-in2/W)0.597
Thermal Resistance @10 psi Min (C-in2/W)0.339
Thermal Resistance @30 psi Max (C-in2/W)0.441
Thermal Resistance @30 psi Min (C-in2/W)0.244
Thermal Resistance @50 psi Max (C-in2/W)0.392
Thermal Resistance @50 psi Min (C-in2/W)0.188
Electrical PropertiesDielectric Constant3.20
Volume Resistivity5.00 x10^13 Ohm-cm
Mechanical PropertiesHardness (Shore 00)70
DimensionsThickness Max (inches)0.200
Thickness Max (mm)5.08
Thickness Min (inches)0.010
Thickness Min (mm)0.25
ROHS CompliantYes
UL Flammability RatingHB


Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21




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