Silicone based Thermal Gap Filler
Creates Compression Of Interface Material
Tputty 502 is the best material for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness.
Tputty 502 will flow and ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty 502 has a high thermal conductivity, resulting in very low thermal resistance.
Tputty 502 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance.
Bulk:
Tputty 502 is available in bulk form in the following sizes: 100 cc Jar 500 cc Jar 1000 cc Jar
Consult the factory for alternate bulk sizes.
Standard Sheet Sizes
9 x 9 (229mm x 229mm) and 18 x 18 (457mm x 457mm).
9 x 9 only over 0.100 thickness
Tputty 502 is available in individual die cut shapes. Pressure sensitive adhesive is not applicable for Tputty products.
Reinforcement
Tputty 502 sheets are reinforced on both sides with fiberglass.
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
Features and Benefits
- Extremely soft and compliant
- Low Dielectric Constant
