Tputty ™ 607

Tputty ™ 607

One Part Liquid Dispensable Gap Filler

Laird Tputty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations. Tputty 607 is ideal for applications that can benefit from automation; and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty 607 will exert minimal stress on your component while maintaining interface contact to maximize thermal transfer. Combined with Laird’s global technical support and global footprint, deploying Tputty 607 is easier than ever.

Features and Benefits

  • Demonstrated thermal cycling stability
  • Low outgassing per ASTM E595
  • Complete Dispensing Solution Options Available
  • Available in 75cc, 180cc, 360cc, 600cc cartridges, 13kg pails, and 20kg pails

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 22/04/21

Technical Specification

Typical PropertiesColorBlue
Density (g/cc)3.50
Minimum Bondline Thickness (microns)150
Minimum Bondline Thickness (mm)0.15
Operating Temperature Max (Celsius)200
Operating Temperature Min (Celsius)-40
Outgassing CVCM (%)0.010
Outgassing TML (%)0.204
Shelf Life6 months
Thermal PropertiesThermal Conductivity (W/mK)6.40
Electrical PropertiesDielectric Constant15.00
Volume Resistivity1.00 x10^13 Ohm-cm
ComplianceROHS CompliantYes
UL Flammability RatingV-0

Documents

Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 27/12/21
Last Updated: 22/04/21
Last Updated: 03/06/22

Industries

Aerospace/DefenseAutomotiveConsumerTelecom/Datacom

Applications

Automotive ElectronicsDrones/SatellitesGaming SystemsNotebooks/Tablets/Portable DevicesServersSmart Home DevicesWireless infrastructure