Tputty™ 910

Tputty™ 910

One Part Liquid Dispensable Gap Filler

With 9.1W/m.K thermal conductivity, Tputty™ 910 is at the forefront of thermal performance of liquid gap filler. It is one-part dispensable gap filler, ready-to-use, not requiring any curing operation.
Tputty™ 910 is a soft, compliant, high thermal conductivity dispensable gap filler providing lowest thermal resistance and highest reliability available.
For More Information, please ask through https://www.laird.com/contact 

Features and Benefits

  • Thermal conductivity 9.1W/mK
  • dispensable and compliant
  • easily reworkable
  • ideal for large and small gaps
  • meets RoHS and REACH requirements

Capabilities

Automated PackagingAutomated Pad PlacementCustom AutomationCustom Product DevelopmentModelingPrototypingServiceTesting

Datasheets

Last Updated: 01/06/23

Technical Specification

Typical PropertiesColorlight red
Density (g/cc)3.20
Minimum Bondline Thickness (microns)180
Operating Temperature Max (Celsius)180
Operating Temperature Min (Celsius)-40
Thermal PropertiesThermal Conductivity (W/mK)9.10
Electrical PropertiesDielectric Breakdown Voltage (Volts AC)6.0

Documents

Last Updated: 31/05/23
Last Updated: 31/05/23
Last Updated: 31/05/23
Last Updated: 13/06/23

Industries

5G Data InfrastructureAutomotive and Industrial ElectronicsServers

Applications

Automotive ElectronicsAutomotive Powertrain/ECUsBase station/Power amplifier/Acitve antenna unit /small cellOptical ModuleServers