Coolshield Flex

Hybrid - ISE

Flexible very low height board level shield cover with superior thermal transfer abilities

Thermal and EMI Shielding Film

CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with a board level shielding (BLS) frame, CoolShield-Flex can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as tablets and other consumer electronics.

Coolshield Flex Series

coolshield-flex-image

Thermal and EMI Shielding Film CoolShield-Flex is a stack-up film of thermal gap filler, metal foils and conductive pressure sensitive