Flexible very low height board level shield cover with superior thermal transfer abilities
Thermal and EMI Shielding Film
CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with a board level shielding (BLS) frame, CoolShield-Flex can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as tablets and other consumer electronics.
Thermal and EMI Shielding Film CoolShield-Flex is a stack-up film of thermal gap filler, metal foils and conductive pressure sensitive
Unit 4B Caerphilly Business Park
Caerphilly CF83 3GS