Tlam Thermally Conductive PCB System

Tlam Thermally Conductive PCB System

Thermal Interface Materials

Tlam™ is a thermally conductive insulted metal PCB substrate system used for heat dissipation in electronics circuit boards These boards are used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.

Tlam™ Building Blocks

Thermally Conductive Dielectric Tlam™ PP
Double Sided Laminate “Cores” Tlam™ DS
Insulated Metal PCB, Tlam™ SS

The heart of this system is the thermally conductive pre-preg, Tlam PP 1KA or Tlam PP HTD. These ceramically filled dielectric prepreg offers 8-10 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. Tlam PP is a “B” State epoxy film providing room temperature stability for 6 months. Tlam PPs are provided in multiple thicknesses. Thinner films offer better thermal performance while thicker films offer better dielectric strength.

Tlam PPs can be used to build many different combinations of PCB laminates. The simplest Tlam is copper foil, Tlam PP dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam PP and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.

Tlam PP can be laminated with copper foils from 1/2 oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick.  This configuration is Tlam SS.

Further Tlam PP can be laminated on both sides with copper films to make traditional type PCB Cores.  This configuration is Tlam DS.

For detailed information on Design and Fabrication:

Other reference documents:

Tlam boards are used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.

Tlam Thermally Conductive PCB System Series

Techni3

Thermally Conductive Pre-preg Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in

Techni3

Thermally Conductive Pre-preg Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in