Configured to Defend
With the recent progress of wireless telecommunication, intelligent satellite systems, and the Internet of Things (IoT), there’s a constant demand for low-loss dielectric materials. The exact properties of these materials – the composition, purity, and processing conditions – are critical to their performance and endurance over time. Laird has a full line of state-of-the-art, reliable dielectrics products that range from 1.05 to 30 dielectric constant in rod, sheet form or even 3D shape, rigid or molded. We can custom fabricate anything to your needs. What’s more, we have the modelling and testing capabilities to ensure your project is completed with ease and perfection.
Benefits of our Low Loss Dielectrics
Find or Design Your Absorber
Using Laird-manufactured parts, our team of global experts and engineers create a custom design experience that is unrivaled by our competitors. Explore our robust line of absorber products or contact an engineer through customer service to discuss your next solution.
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ECCOSTOCK 0005 is a translucent polystyrene based thermosetting exhibiting low loss dielectric properties
ECCOSTOCK FFP is a powder curing into a rigid foam, perfect to fill cavities.
Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and microwave insulation.
ECCOSTOCK HIK500F is a low loss stock with adjusted dielectric constants up to 30 and over 200°c temperature resistance.
Rigid closed cell dielectric foam Unlike most polyurethanes, Eccostock SH has an extremely low dissipation factor and low dielectric constant.
Due to the low dielectric constant, the materials are essentially transparent to electromagnetic energy. It offers excellent thermal insulation. Eccostock
Light weight dielectric thermoset Eccostock LOK weighs only about half that of polystyrene and one quarter that of polytetrafluorethylene, making
Low outgassing properties make them suitable for space applications. It exhibits a very low water absorption (<0.1) making it of
It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has
ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place.
Eccostock 0005 is showing good machinability and can easily be bonded to other material. It s a good choice for
High temperature tuned low loss dielectric stock When subjected to high temperatures, the surface will darken. This however has no
Unit 4B Caerphilly Business Park
Caerphilly CF83 3GS